The key objectives of the program were to provide a comprehensive understanding of the SMT and PCB assembly process flow, enable participants to gain hands-on experience on a semi-automatic SMT production line, to familiarize faculty with key equipment: Screen Printer, Pick & Place Machine, and Reflow Oven, to impart knowledge of quality checks, Automated Optical Inspection (AOI), and troubleshooting methods, expose participants to best practices for high-quality PCB assembly in an industrial setting, enhance the teaching effectiveness of engineering faculty by grounding theory in current industry practices.